Excellent+Dissertation+Award
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Professor Shin In Shik First in Asia to receive Excellent Dissertation Award from IEEE RTSS
The research team lead by Professor Shin In Shik (Department of Computer Science) received the Excellent Dissertation Awardy in the IEEE RTSS out of 157 dissertations.
It is the first time a Professor under an institute in the Asia region received the Award in the RTSS field during its 33 year history.
Professor Shin had already received an Excellent Dissertation Award as a Ph.D. candidate at the University of Pennsylvania. Thus Professor Shin became the first and only scientist to receive the Award twice.
Professor Shin has successfully defined the scheduling method of the multicore processor which was regarded as the problem in the field of RTSS for the past decade.
Professor Shin has suggested new criteria for sorting real time tasks in parallel thereby suggesting a new scheduling method that surpasses current scheduling methods. The results are anticipated to provide new perspectives in the field of RTSS using multicore processors.
2013.01.22 View 7761 -
A Step Closer to Ultra Slim Mobile Phone
Professor Baek Kyung Wook (department of Material Science and Engineering) succeeded in developing an ultra-thin conjugation technique that can perfectly replace the modular contact in electronic devices.
The research team developed a compound material using ultra-fine solder-adhesive film and developed the vertical ultrasonic conjugation process thereby making a reliable utra-thin conjugation.
The developed technique allowed for very thin and reliable conjugation and will be able to replace the socket type connector and is expected to revolutionize the electronic device industry.
In mobile electronic devices like the smartphone, the trend is to incorporate various functional modules like camera, display, touchscreens, etc. in addition to striving for miniaturization of the device.
Recently the problem was the fact that the number of modules within the device was increasing due to the incorporation of various functions, and consequently the volume that these modules took up increased as well, which made miniaturization almost impossible.
Professor Baek‘s team succeeded in improving upon this problem by creating a compound material that has ultra-fine solder particles that can melt to form alloy fusion with the electrode and thermosetting adhesive film that can wrap around the electrode and provide mechanical protection.
The use of this material made it possible to reduce the thickness of the connector by hundredth fold which improved electrical, mechanical properties and highly reliable.
From a processing standpoint the conventional conjugation process involved heating the mechanical block and was therefore hard to manage its production and also consumed 1000W and took up to 15 seconds.
By contrast, Professor Baek’s team’s new process uses only ultrasound to locally heat and melt the conjugation point itself thereby reducing power consumption to 100W and conjugation time to 1~5 seconds.
The technique developed by Professor Baek and Lee Ki Won Doctorate student was awarded Excellent Dissertation Award by world famous journals like the Electronic Components and Technology Conference and is being recognized worldwide.
2012.01.31 View 8840